蓝思科技联手英特尔，将AI先进芯片封装引入长沙

Lens Technology, a leading precision manufacturing platform based in Changsha, China, announced on July 24, 2026, that its wholly-owned subsidiary Lens International (Hong Kong, China) has signed a memorandum of understanding (MOU) with Intel, the U.S. semiconductor giant. The partnership centers on Through Glass Via (TGV) advanced packaging technology — a critical enabler for next-generation AI computing chips and high-bandwidth memory — and extends to joint development across AI PCs, computing servers, and embodied intelligent robotics, forging a cross-border alliance that links Changsha's manufacturing base directly to the global semiconductor supply chain.

2026年7月24日，总部位于中国长沙的精密制造平台企业蓝思科技（Lens Technology）发布公告，其全资子公司蓝思国际（香港）已与美国半导体巨头英特尔（Intel）签署合作备忘录。双方以玻璃通孔（TGV）先进封装技术为核心合作方向——该技术是下一代AI计算芯片和高带宽内存的关键支撑——并同步探索AI PC、算力服务器、具身智能机器人等多领域协同落地，构建起将长沙制造体系直连全球半导体供应链的跨国产业联盟。

Rooted in Changsha for over 20 years, Lens Technology has grown from a single-category glass processor into a precision manufacturing conglomerate spanning consumer electronics, automotive hardware, intelligent robotics, and computing infrastructure. The company operates multiple industrial parks in Xingsha, Liuyang, and Yong'an with combined investments reaching tens of billions of yuan (RMB), directly supporting a network of over 200 local suppliers across Hunan Province. TGV glass substrates are widely regarded as the cornerstone of advanced packaging in the post-Moore's Law era; market analysts project 2026 as the technology's commercialization milestone, with the global TGV market expected to exceed USD 32 billion by 2030. By embedding cutting-edge semiconductor packaging processes into its Changsha facilities, the Intel partnership fills a strategic gap in the region's high-end packaging substrate capabilities. Through Intel's global technology channels, Changsha's manufacturing ecosystem gains deeper integration into the worldwide AI hardware supply chain, positioning the city to evolve from terminal component fabrication toward core semiconductor material research and development — and reinforcing central China's competitive advantage in precision manufacturing.

蓝思科技扎根长沙二十余年，已从单一玻璃加工厂商发展为覆盖消费电子、车载硬件、智能机器人、算力结构件的精密制造平台，在星沙、浏阳、永安布局多座累计投资数百亿元人民币的产业园区，直接带动湖南省内200余家配套企业协同发展。TGV玻璃基板被公认为后摩尔时代先进封装的核心载体，市场机构预计2026年为商业化元年，2030年全球市场规模将突破320亿美元。英特尔合作将前沿半导体封装工艺植入长沙生产基地，填补了当地在高端封装基材领域的战略空白。借助英特尔全球技术渠道，长沙制造体系将深度接入全球AI硬件供应链，推动城市从终端零部件制造向半导体核心基材研发延伸，进一步强化中国中部地区在精密制造领域的竞争壁垒。